製品情報PRODUCT INFORMATION

  • 01カスタムボード
  • Custom boards

Performance boards
(final test board)

■後工程テスト用　　For final tests
・ICテスターメーカー様仕様に準拠した製品をご提供できます。
・超多層、各種基板サイズ、板厚に対応し、仕様に基づき最適な条件での設計・製造をします。
・基板材料もFR-5相当から低誘電率材まで全てに対応します。
・Able to offer products that comply with IC testing company specifications.
・Design and produce circuit boards to meet super multi-layer, board size, and board thickness specifications
・Can deal with circuit material from FR-5 to low dielectric-constant substrates

Probe cards

■前工程テスト用　　For wafer tests
・超多層にも対応、基板サイズ、板厚、仕様により最適な基板材料で製作しご提供します
・Our products are produced using the most suitable substrate material based on board size, board thickness, and super multi-layer specifications.

IC evaluation
boards

■各種用途により製作します
We make the following products
・OS（オープン/ショート）テスト用
・特殊なカスタム基板
・BOSTカード
・IC販売促進用評価基板
・社内評価用基板など
・OS(Open/Short) test boards
・Specific custom boards
・BOST cards
・IC sales promotion evaluation boards
・Internal evaluation boards etc..

Burn-in boards

バーインボード
Burn-in board

■お客様のご要望により仕様から完成品まで、また周辺機器もご提供します。
We support the Burn-in board and peripheral equipment.

 

周辺装置（コントローラー）
Peripheral equipment (Controller)

  • 02汎用基板（スタンダードボード）
  • Standard circuits boards

LE series

  • ■各種マニュアル用パフォーマンスボード Performance circuit boards for manual work.
  • ■各種プローバ用パフォーマンスボード Performance circuits boards for prober-use.
  • ■各種プローブカード For Probe cards.
  • ■各種ヘッド/ソケットボード For head and socket boards.
  • ・LE100564A
  • ・LE100648
  • ・LE100661
  • ・LE100662
  • ・LE101383
  • ・LE11341
  • ・LE10191
  • ・LE11623
  • ・LE11342
  • ・LE11157
  • ・LE11758
  • ・LE10619
  • ・LE11149
  • ・LE11169
  • ・LE11067
  • ・LE11065
  • ・LE11753
  • ・LE11062
  • ・LE11144
  • ・LE11148
  • ・LE11147
  • ・LE101932
  • ・LE10514-161H
  • ・LE10537
  • ・LE10514
  • ・LE11097
  • ・LE11105
  • ・LE11056
  • ・LE67-50
  • 03TalentPros製品の販売
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■リレーテスター
TPS-310
■FPGAボード
TXZ-13xx series ARM based
TPS-KUxx, VUxx

 

We support the customized FPGA boards TXZ-, TPS- series for test board and relay tester TPS-310.

 

Relay tester TPS-310

 

FPGA board

  • 04特殊基板の設計製造販売
    (ご要望に応じた基板を開発します)
  • Design and manufacturing of custom boards
    (Boards are developed depending on customer requirements)

Thick copper high
current multi-layer
boards

One layer can collect the power supply for a power circuit, a signal line part and a component mounting part using a copper thickness of 300-500 μ in the inner layer.

The different type of materials composite multilayered board (it is possible to for the substrate material to be multilayered. Previously multilayer processing was difficult)

It is composed of different kinds of materials which have different characteristic and have been made into one piece. It is possible to make such a board suitable for required purposes.

Multilayered
circuit board
with a built-in
component

To incorporate tip parts and film resistance in the insulation resin layer and enable a reduction in the size of the mounting component on the surface layer.

Circuit boards for high temperature (most suitable for a high temperature test)

The circuit board is able to maintain the high temperature around the DUT for a certain period of time.