製品情報PRODUCT INFORMATION

  • 01カスタムボード
  • Custom boards

Performance boards
(final test board)

■後工程テスト用　　For final tests
・ICテスターメーカー様仕様に準拠した製品をご提供できます。
・超多層、各種基板サイズ、板厚に対応し、仕様に基づき最適な条件での設計・製造をします。
・基板材料もFR-5相当から低誘電率材まで全てに対応します。
・Able to offer products that comply with IC testing company specifications.
・Design and produce circuit boards to meet super multi-layer, board size, and board thickness specifications
・Can deal with circuit material from FR-5 to low dielectric-constant substrates

Probe cards

■前工程テスト用　　For wafer tests
・超多層にも対応、基板サイズ、板厚、仕様により最適な基板材料で製作しご提供します
・Our products are produced using the most suitable substrate material based on board size, board thickness, and super multi-layer specifications.

IC evaluation
boards

■各種用途により製作します
We make the following products
・OS（オープン/ショート）テスト用
・特殊なカスタム基板
・BOSTカード
・IC販売促進用評価基板
・社内評価用基板など
・OS(Open/Short) test boards
・Specific custom boards
・BOST cards
・IC sales promotion evaluation boards
・Internal evaluation boards etc..

Burn-in boards

■お客様の仕様により設計から対応しております。
We meet customer specifications from the design of the boards onwards.
  • 02汎用基板（スタンダードボード）
  • Standard circuits boards

LE series

  • ■各種マニュアル用パフォーマンスボード Performance circuit boards for manual work.
  • ■各種プローバ用パフォーマンスボード Performance circuits boards for prober-use.
  • ■各種プローブカード For Probe cards.
  • ■各種ヘッド/ソケットボード For head and socket boards.
  • ・LE100564A
  • ・LE100648
  • ・LE100661
  • ・LE100662
  • ・LE101383
  • ・LE11341
  • ・LE10191
  • ・LE11623
  • ・LE11342
  • ・LE11157
  • ・LE11758
  • ・LE10619
  • ・LE11149
  • ・LE11169
  • ・LE11067
  • ・LE11065
  • ・LE11753
  • ・LE11062
  • ・LE11144
  • ・LE11148
  • ・LE11147
  • ・LE101932
  • ・LE10514-161H
  • ・LE10537
  • ・LE10514
  • ・LE11097
  • ・LE11105
  • ・LE11056
  • ・LE67-50
  • 03ガラス基板
  •  

ガラスの特性を利用した製品への対応が可能になります。例えば高温・低温仕様への対応や透過性を活かす事が出来ます。
*両面ガラス基板は特許申請中

To achieve the new products by using the special feature of glass. Can take advantage of high/low temperature specification and high transparency.
*Patent pending for double-sided glass PCB.

主な仕様
対応材料：ソーダガラス、無アルカリガラス、硼硅酸ガラスなど全般
ガラス厚：100μm～
VIA径：100μm～（50μmは試作中）
配線幅：10μm～
配線ピッチ：10μm～
両面基板
Specifications
Material: Soda glass, Non-Alkali, Borosilicate glass, others.
Glass thickness:100μm～
VIA size：100μm～（50μm is trial now）
Pattern width: 10μm～
L/S width：10μm～
Double-sided printed glass board

製品試作
ガラス材：ソーダガラス
ガラス厚：0.55mm
ガラスサイズ：60x60mm
VIA径：0.1mm、0.2mm、0.4mm
パターン幅：0.1mm
両面
Sample specifications
Material: Soda glass
Glass thickness: 0.55mm
Glass size:60x60mm
VIA size：0.1mm、0.2mm、0.4mm
Pattern size：0.1mm
Double-sided printed glass board

製品試作
ICソケット
*特許申請中
Sample specifications
IC socket
*Patent pending

製品試作
ガラス基板平面スピーカー
Sample specifications
Flat speaker with Glass
応用製品
ウエハー検査用、ICソケット、医療機器、タッチパネル、液晶モジュール、高周波製品、ミリ波製品、X線機器、高温/低温対応製品、透過性が必要な製品、そのた
Typical application:
IC tester(wafer test), IC socket, Medical Equipments, Touch panel, LCD module, RF products, Millimeter-wave, X-Ray Equipments, High and low temperature products, High transparent products, etc….
  • 04特殊基板の設計製造販売
    (ご要望に応じた基板を開発します)
  • Design and manufacturing of custom boards
    (Boards are developed depending on customer requirements)

High thermal
conductivity
and heavy current
circuit boards
(using clad metal)

Using clad metal which is metal combined with copper foil of various thicknesses, a signal circuit of various thicknesses on the same plane is possible.

Thick copper high
current multi-layer
boards

One layer can collect the power supply for a power circuit, a signal line part and a component mounting part using a copper thickness of 300-500 μ in the inner layer.

Aluminum surface
refining process
(improves heat
dissipation and
bondability with
the resin)

Refines the aluminum surface to make it more complex and rough, and due to this surface area improvement, heat dissipation is improved.

High frequency use
aluminum heat
dissipation board
(improves adhesive
property of the low
dielectric resin and
aluminum board)

It is most suitable for a high frequency circuit board which needs to deal with heat and high power antennas.

Copper plate heat
radiation board
(printed circuit board
with a copper plate
which improves
heat radiation.)

To conduct a fin, pillar, or embossing process on the surface of the copper plate and improve heat radiation with our company's unique technique.

High frequency
communication use
antenna,
circuit board

It uses a substrate material and an antenna of various frequencies depending on the selected specification.

Cyclo-Olefin-Polymer
(COP)
material circuit board
(for high frequency
uses)

Minimizes conductor loss. This circuit board uses a high-speed signal transmission and a high frequency connector.

The different type of materials composite multilayered board (it is possible to for the substrate material to be multilayered. Previously multilayer processing was difficult)

It is composed of different kinds of materials which have different characteristic and have been made into one piece. It is possible to make such a board suitable for required purposes.

Hollow conductor board (flying pad)

The board is suitable for use for a circuit board equipped with aerial wiring. to improve the dielectric constant, and for fuse circuits.

Smoothing
circuit board

A conductor circuit part is embedded in base material resin and such boards can be thin.

Multilayered
circuit board
with a built-in
component

To incorporate tip parts and film resistance in the insulation resin layer and enable a reduction in the size of the mounting component on the surface layer.

Circuit boards for high temperature (most suitable for a high temperature test)

The circuit board is able to maintain the high temperature around the DUT for a certain period of time.